The Development Trend of BGA Assembly Technology
With the rapid development of LSI technology, the through-hole technology (THT) that flourished in the 1960s has gradually been replaced by the first generation of surface mount technology (SMT), which emerged in the 1980s. By the late 1970s, peripheral packaging had become the mainstream of electronic packaging, and QFP packaging had been widely adopted. In the 1990s, QFP packaging witnessed a fine pitch and leading board assembly technology; however, many technical issues remained unsolved in the assembly of board-level circuits with less than 0.4mm pitch. Thus, the second generation of SMT, ball grid array packaging (BGA), was launched in the early 1990s and became the preferred solution.
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